Bonded Silicon on Insulator Wafers

SOI Wafers from UniversityWafer.com
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Bonded Silicon on Insulator Wafers

We have a large selection of bonded SOI substrates in stock.

Diameter range form 76.2mm to 300mm wafers and in quantities as few as one wafer.

Our SOI inventory includes:

  • DSOI for a large range of IC and MEMS applications
  • SiSi - (no thermal oxide) - The use of direct wafer bonding technology allows silicon substrates to be produced containing multiple layers of single crystal silicon
  • DSP wafers are an excellent substrate for double sided lithography processing
  • Cavity Bonded SOI (CSOI) - allows researchers to develop more intelligent devices in order to meet the most demanding markets.
  • Trench SOI (TSOI) - works great for MEMS devices
  • TSV - Great for BioMEMS

See below for the Thinnest Device Bonded SOI wafers:

SOI Item#4220100

100mm P/B (100) 1-10 ohm-cm 625um SSP
Device 220nm, Box 1um

SOI Item #6220105

100mm N/Ph (100) 1-10 ohm-cm 625um SSP
Device 220nm, Box 1um

SOI Item #6220055

150 N/P <100> 1-10 ohm-cm 625um SSP
Device 220nm >5000 ohm-cm, Box 0.5um

SOI Item #6220100

150 P/B <100> 1-20 ohm-cm 625um SSP
Device 220nm 1-20 ohm-cm, Oxide 1um

Other specs and small quantities available!