Bonded Silicon on Insulator Wafers
We have a large selection of bonded SOI substrates in stock.
Diameter range form 76.2mm to 300mm wafers and in quantities as few as one wafer.
Our SOI inventory includes:
- DSOI for a large range of IC and MEMS applications
- SiSi - (no thermal oxide) - The use of direct wafer bonding technology allows silicon substrates to be produced containing multiple layers of single crystal silicon
- DSP wafers are an excellent substrate for double sided lithography processing
- Cavity Bonded SOI (CSOI) - allows researchers to develop more intelligent devices in order to meet the most demanding markets.
- Trench SOI (TSOI) - works great for MEMS devices
- TSV - Great for BioMEMS
See below for the Thinnest Device Bonded SOI wafers:
SOI Item#4220100
100mm P/B (100) 1-10 ohm-cm 625um SSPDevice 220nm, Box 1um
SOI Item #6220105
100mm N/Ph (100) 1-10 ohm-cm 625um SSP
Device 220nm, Box 1um
SOI Item #6220055
150 N/P <100> 1-10 ohm-cm 625um SSPDevice 220nm >5000 ohm-cm, Box 0.5um
SOI Item #6220100
150 P/B <100> 1-20 ohm-cm 625um SSPDevice 220nm 1-20 ohm-cm, Oxide 1um
Other specs and small quantities available!